Pages that link to "Item:Q1415907"
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The following pages link to Diffusive shrinkage of a void within a grain of a stressed polycrystal. (Q1415907):
Displaying 5 items.
- The stress intensity factor of an edge dislocation near an elliptically blunted crack tip (Q602097) (← links)
- Effects of electric and mechanical loads on the morphological evolution of a void in piezoelectric films (Q622943) (← links)
- Pore migration under high temperature and stress gradients (Q1009771) (← links)
- Void growth due to creep and grain boundary diffusion at high triaxialities (Q1354914) (← links)
- The voids kinetics during diffusion process (Q1618540) (← links)