Pages that link to "Item:Q1579965"
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The following pages link to General solutions for thermopiezoelectrics with various holes under thermal loading (Q1579965):
Displaying 15 items.
- Hybrid fundamental solution based finite element method: theory and applications (Q277799) (← links)
- Analysis of a crack in a finite thermopiezoelectric plate under heat flux (Q712309) (← links)
- The general solution for a finite thermopiezoelectric plate containing a hole and a crack (Q1020227) (← links)
- Green's function for thermopiezoelectric plates with holes of various shapes (Q1294835) (← links)
- Some problems in plane thermopiezoelectric materials with holes (Q1303073) (← links)
- Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory (Q1659811) (← links)
- Efficient hypersingular line and surface integrals direct evaluation by complex variable differentiation method (Q1740254) (← links)
- Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method (Q1756253) (← links)
- A new thermoelectroelastic solution for piezoelectric materials with various openings (Q1818657) (← links)
- An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media (Q1858736) (← links)
- Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids (Q2003135) (← links)
- Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM (Q2269255) (← links)
- Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects (Q2310567) (← links)
- The generalized two dimensional thermal-electro-elastic solution for the cracked-half-elliptical-hole problem in a half plane (Q2634384) (← links)
- Closed-form solutions of an elliptical crack subjected to coupled phonon–phason loadings in two-dimensional hexagonal quasicrystal media (Q5244344) (← links)