Pages that link to "Item:Q1858679"

The following pages link to Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts (Q1858679):

Displaying 30 items.

• Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws (Q361949) (← links)
• Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016) (← links)
• On the influence of electric boundary conditions on dynamic SIFs in piezoelectric materials (Q363166) (← links)
• Arc-shaped interfacial crack in a non-homogeneous electro-elastic hollow cylinder with orthotropic dielectric layer (Q399752) (← links)
• Interaction between an electrically permeable crack and the imperfect interface in a functionally graded piezoelectric sensor (Q541063) (← links)
• Crack tip shielding and anti-shielding effects of the imperfect interface in a layered piezoelectric sensor (Q546649) (← links)
• Multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate (Q642175) (← links)
• Propagation of a mode-III interfacial conductive crack along a conductive interface between two piezoelectric materials (Q661454) (← links)
• Numerical analysis for a crack in piezoelectric material under impact (Q833832) (← links)
• Fracture analysis on a piezoelectric sensor with a viscoelastic interface (Q837910) (← links)
• Propagation of a semi-infinite conducting crack in piezoelectric materials: mode-I problem (Q904741) (← links)
• Transient dynamic response of piezoelectric bodies subjected to internal electric impulses (Q1302315) (← links)
• Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts (Q1401655) (← links)
• Transient response of a piezoelectric ceramic strip with an eccentric crack under electromechanical impacts. (Q1422968) (← links)
• Transient response of a crack in piezoelectric strip subjected to the mechanical and electrical impacts: Mode-III problem (Q1579818) (← links)
• The transient response of a piezoelectric strip with a vertical crack under electromechanical impact load (Q1580946) (← links)
• An interaction integral and a modified crack closure integral for evaluating piezoelectric crack-tip fracture parameters in BEM (Q1655350) (← links)
• Impact response of an interface crack in a hybrid piezoelectric laminate (Q1861153) (← links)
• Impact response of a finite crack in an orthotropic piezoelectric ceramic (Q1970807) (← links)
• Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case (Q2033723) (← links)
• Transient fracture of a piezoelectric-piezomagnetic sandwich structure: anti-plane case (Q2285451) (← links)
• A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface (Q2306911) (← links)
• Transient response of dissimilar piezoelectric layers with multiple interacting interface cracks (Q2307169) (← links)
• Study of a propagating finite crack in functionally graded piezoelectric materials considering dielectric medium effect (Q2428226) (← links)
• Interfacial coplanar cracks in piezoelectric bi-material systems under pure mechanical impact loading (Q2456078) (← links)
• Transient response of a semi-infinite piezoelectric layer with a surface permeable crack (Q2498501) (← links)
• Transient response of an insulating crack near to the interface between two piezoelectric half-planes under electromechanical impacts by BEM (Q2520378) (← links)
• Transient response of an annular interfacial crack between dissimilar piezoelectric layers under mechanical and electrical impacts (Q2897199) (← links)
• The extended finite element method with new crack-tip enrichment functions for an interface crack between two dissimilar piezoelectric materials (Q2952761) (← links)
• A crack in a piezoelectric layer bonded to a dissimilar elastic layer under transient load (Q5945345) (← links)