Pages that link to "Item:Q2056570"
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The following pages link to Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570):
Displaying 5 items.
- Stress intensity factors for bonded two half planes weakened by thermally insulated cracks (Q828231) (← links)
- Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations (Q1984926) (← links)
- Stress intensity factor for bonded dissimilar materials weakened by multiple cracks (Q1988685) (← links)
- On a symplectic analytical singular element for cracks under thermal shock considering heat flux singularity (Q1988918) (← links)
- Approximate structures of thermoelastic fields induced by a penny-shaped thermal-medium crack in a transversely isotropic layer (Q2109553) (← links)