Pages that link to "Item:Q2456310"
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The following pages link to Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies (Q2456310):
Displaying 5 items.
- Improved tri-layered interfacial stress model with the effect of different temperatures in the layers (Q363442) (← links)
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles (Q1028753) (← links)
- Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model (Q1274155) (← links)
- A 3-D thermoelastic analysis of the buckling of a layer bonded to a compliant substrate and related problems (Q1959988) (← links)
- Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (Q3605175) (← links)