Pages that link to "Item:Q2511583"
From MaRDI portal
The following pages link to An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction (Q2511583):
Displaying 4 items.
- Interfacial stress analysis of a CFRR-metal adhesively bonded joint with/without defect under hygrothermal environment (Q2307221) (← links)
- Theoretical study on residual thermal stresses caused by the brazing process in annular and bilayer structures (Q2679219) (← links)
- Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends (Q4362339) (← links)
- Debonding fracture of bonded bimaterial semi‐strips subjected to concentrated forces and couples (Q6065024) (← links)