Pages that link to "Item:Q2517475"
From MaRDI portal
The following pages link to An unfitted finite element method for the numerical approximation of void electromigration (Q2517475):
Displaying 7 items.
- A fitted finite element method for the numerical approximation of void electro-stress migration (Q268875) (← links)
- Finite element approximation of a three dimensional phase field model for void electromigration (Q618416) (← links)
- A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid (Q1306116) (← links)
- Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
- Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692) (← links)
- A phase field model for the electromigration of intergranular voids (Q2468800) (← links)
- Models of void electromigration (Q2730753) (← links)