Pages that link to "Item:Q363630"

The following pages link to Thermal stress intensity factors for an interface crack in a functionally graded layered structures (Q363630):

Displaying 14 items.

• Thermal stresses factors of orthotropic graded layers with a finite line bond (Q398158) (← links)
• Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer (Q398566) (← links)
• Fracture analysis of a nonhomogeneous coating/substrate system with an interface under thermal shock (Q405024) (← links)
• A periodic array of cracks in functional graded materials subjected to thermo-mechanical loading (Q534116) (← links)
• Mixed-mode fracture analysis of orthotropic functionally graded materials under mechanical and thermal loads (Q833767) (← links)
• Effects of multiple cracking on the residual strength behavior of thermally shocked functionally graded ceramics (Q838504) (← links)
• Thermal shock analysis for a functionally graded plate with a surface crack (Q925896) (← links)
• Thermal stresses in a laminate composite with a row of interface cracks (Q1121689) (← links)
• Edge crack problem in a semi-infinite FGM plate with a bi-directional coefficient of thermal expansion under two-dimensional thermal loading (Q1595280) (← links)
• Thermoelastic analysis of nonhomogeneous structural materials with an interface crack under uniform heat flow (Q1732156) (← links)
• Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure (Q1959879) (← links)
• Thermal shock fracture of a crack in a functionally gradient half-space based on the memory-dependent heat conduction model (Q1989005) (← links)
• Thermal loading in multi-layered and/or functionally graded materials: residual stress field, delamination, fatigue and related size effects (Q2455867) (← links)
• Crack closure effects in thermal fracture of functionally graded/homogeneous bimaterials with systems of cracks (Q2786633) (← links)