Pages that link to "Item:Q398566"
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The following pages link to Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer (Q398566):
Displaying 6 items.
- Thermal stresses factors of orthotropic graded layers with a finite line bond (Q398158) (← links)
- Stress intensity factors for bonded two half planes weakened by thermally insulated cracks (Q828231) (← links)
- A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply (Q991627) (← links)
- Thermoelastic analysis of nonhomogeneous structural materials with an interface crack under uniform heat flow (Q1732156) (← links)
- Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials (Q2428324) (← links)
- Thermoelastic response of laminated plates considering interfacial conditions and cracks based on peridynamics (Q6157749) (← links)