Pages that link to "Item:Q5051004"
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The following pages link to Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading (Q5051004):
Displaying 6 items.
- Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756) (← links)
- Fatigue and fracture assessment for reliability in electronics packaging (Q944280) (← links)
- Electro-chemo-mechanical induced fracture modeling in proton exchange membrane water electrolysis for sustainable hydrogen production (Q2083189) (← links)
- Multiphysics computation of thermal tissue damage as a consequence of electric power absorption (Q2665025) (← links)
- Virtual element method for phase field modeling of dynamic fracture (Q6097594) (← links)
- Residual-based error corrector operator to enhance accuracy and reliability of neural operator surrogates of nonlinear variational boundary-value problems (Q6185165) (← links)