Pages that link to "Item:Q840878"
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The following pages link to Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies (Q840878):
Displaying 6 items.
- Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method (Q936378) (← links)
- Thermal management of high power electronics with phase change cooling (Q1579224) (← links)
- Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications (Q1948875) (← links)
- Multi-objective optimization of a rotating cooling channel with staggered pin-fins for heat transfer augmentation (Q2882457) (← links)
- Optimization Of Thermo-Electric Coolers Using Hybrid Genetic Algorithm And Simulated Annealing (Q3453364) (← links)
- Optimization of heat sink mass using the DYNAMIC-Q numerical optimization method (Q4785066) (← links)