Pages that link to "Item:Q865139"
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The following pages link to Orientation dependence of fracture toughness measured by indentation methods and its relation to surface energy in single crystal silicon (Q865139):
Displaying 7 items.
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016) (← links)
- Energy considerations in crack deflection phenomenon in single crystal silicon (Q865216) (← links)
- A domain decomposition approach for the simulation of fracture phenomena in polycrystalline microsystems (Q1667283) (← links)
- Analytical description of fracture features in single crystal silicon (Q2035173) (← links)
- Monte Carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks (Q2439195) (← links)
- Fracture of single crystals having layered morphology (Q2519963) (← links)
- Self-emitted surface corrugations in dynamic fracture of silicon single crystal (Q5073097) (← links)