Pages that link to "Item:Q2040778"
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The following pages link to Thermal analysis of electronic packaging structure using isogeometric boundary element method (Q2040778):
Displaying 5 items.
- Applications of FEM for multiple laminated structure in electronic packaging (Q1274174) (← links)
- BEM calculation of the complex thermal impedance of microelectronic devices (Q1958304) (← links)
- An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources (Q2109682) (← links)
- The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure (Q2127930) (← links)
- Steady heat transfer analysis for anisotropic structures using the coupled IGA-EFG method (Q6539824) (← links)