Pages that link to "Item:Q2385960"
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The following pages link to A numerical study on interface crack growth under heat flux loading (Q2385960):
Displaying 12 items.
- A thermomechanical cohesive zone model for bridged delamination cracks (Q597771) (← links)
- A thermo-mechanical cohesive zone formulation for ductile fracture (Q1039508) (← links)
- Modelling transient heat conduction of granular materials by numerical manifold method (Q1656346) (← links)
- A phantom node formulation for modeling coupled adiabatic-isothermal cracking in FRP composites (Q1667328) (← links)
- A thermo-mechanical cohesive zone model (Q1959736) (← links)
- Interaction between a cracked hole and a line crack under uniform heat flux (Q1959835) (← links)
- Fracture of thermo-elastic solids: phase-field modeling and new results with an efficient monolithic solver (Q2022002) (← links)
- Investigation of thermal-induced damage in fractured rock mass by coupled FEM-DEM method (Q2221161) (← links)
- An analysis of the delamination of an environmental protection coating under cyclic heat loads (Q2484304) (← links)
- A coupled cohesive zone model for transient analysis of thermoelastic interface debonding (Q2512456) (← links)
- An integral framework for computational thermo-elastic homogenization of polycrystalline materials (Q2693405) (← links)
- Highly-conductive energetic coherent interfaces subject to in-plane degradation (Q4563212) (← links)