Pages that link to "Item:Q5160754"
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The following pages link to A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures (Q5160754):
Displaying 3 items.
- Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics (Q724455) (← links)
- An analytic model for transient heat conduction in bi-layered structures with flexible serpentine heaters (Q825427) (← links)
- Nonlinear optimal on-line heat-dissipation control methodology in electronic devices (Q1009899) (← links)