Pages that link to "Item:Q546679"
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The following pages link to Computer simulations of nanoindentation on Cu (1 1 1) with a void (Q546679):
Displaying 3 items.
- Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field (Q669730) (← links)
- Pair vs many-body potentials: influence on elastic and plastic behavior in nanoindentation of fcc metals (Q985225) (← links)
- MD simulation of atom-order void formation in Ni fcc metal (Q1586897) (← links)