Pages that link to "Item:Q835385"

The following pages link to Micromechanics modeling of strength for nanocrystalline copper (Q835385):

Displaying 14 items.

• A variational multiscale constitutive model for nanocrystalline materials (Q361357) (← links)
• The ``inverse Hall-Petch'' effect on the impact response of single crystal copper (Q399541) (← links)
• Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates (Q399557) (← links)
• A micromechanical model of toughening behavior in the dual-phase composite (Q422680) (← links)
• Mechanics modeling for deformation of nano-grained metals (Q597794) (← links)
• Atomistic based continuum investigation of plastic deformation in nanocrystalline copper (Q814793) (← links)
• Brittle versus ductile transition of nanocrystalline metals (Q837377) (← links)
• Mechanics of creep resistance in nanocrystalline solids (Q925921) (← links)
• The competition of grain size and porosity in the viscoplastic response of nanocrystalline solids (Q929006) (← links)
• Atomistic and mean-field estimates of effective stiffness tensor of nanocrystalline copper (Q1625250) (← links)
• A theory of compressive yield strength of nano-grained ceramics (Q1877545) (← links)
• The scale effect on the yield strength of nanocrystalline materials (Q2456333) (← links)
• A generalized self-consistent polycrystal model for the yield strength of nanocrystalline materials (Q2486574) (← links)
• Modeling of strengthening and softening in inelastic nanocrystalline materials with reference to the triple junction and grain boundaries using strain gradient plasticity (Q5962230) (← links)