Pages that link to "Item:Q936378"
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The following pages link to Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method (Q936378):
Displaying 5 items.
- Analysis of entropy generation for distributed heating in processing of materials by thermal convection (Q547632) (← links)
- Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules (Q1009813) (← links)
- Nonlinear optimal on-line heat-dissipation control methodology in electronic devices (Q1009899) (← links)
- An optimum spacing problem for four chips on a horizontal substrate -- mixed convection (Q1594538) (← links)
- Thermal optimization of channel flows with discrete heating sections (Q1890377) (← links)