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Numerical analysis of interfacial stress and stress singularity between thin films and substrates - MaRDI portal

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Numerical analysis of interfacial stress and stress singularity between thin films and substrates (Q1267587)

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scientific article; zbMATH DE number 1210074
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English
Numerical analysis of interfacial stress and stress singularity between thin films and substrates
scientific article; zbMATH DE number 1210074

    Statements

    Numerical analysis of interfacial stress and stress singularity between thin films and substrates (English)
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    12 July 1999
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    We discuss the interfacial stress between the thin film and substrate and the stress singularity at the edge in applications to high-Tc superconductor. A boundary element method with fundamental solution for dissimilar materials is introduced to analyze the problem numerically, and a thin film of superconducting ceramics YBCO is treated in numerical calculation. The behavior of singular stress at the edge of the film is compared with theoretical results.
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    high-Tc superconductor
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    fundamental solution
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    superconducting ceramics YBCO
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