Bimaterial interface cracks originating from holes (Q1911106)

The boundary collocation method (BCM) is used to analyse the behavior of the interfacial cracks emanating from a hole in a bimaterial plate. A set of complex stress functions is assumed with \(r^{-1/2+i\varepsilon}\) stress singularity at the crack tips. They can satisfy the equilibrium equations in the domain, the boundary conditions on the crack surfaces, the stress and displacement conditions on the crack surfaces and across the interface, as well as the single-value displacement conditions. Only the boundary conditions on the hole and the external boundary of the plate need to be considered, and they can be approximately treated by the BCM and by least square technique.