A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging |
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A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (English)
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25 June 2020
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boundary element method
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elastic contact problem
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thermoelastic contact
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microelectronic packaging
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variable thermal contact resistance
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