The matching of lead underwriters and issuing firms in the Japanese corporate bond market (Q2227417)
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scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | The matching of lead underwriters and issuing firms in the Japanese corporate bond market |
scientific article |
Statements
The matching of lead underwriters and issuing firms in the Japanese corporate bond market (English)
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15 February 2021
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corporate bonds
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Japan
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matching
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reputation
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underwriter
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