Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (Q2271219)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Electromigration induced strain field simulations for nanoelectronics lead-free solder joints |
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Electromigration induced strain field simulations for nanoelectronics lead-free solder joints (English)
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6 August 2009
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electromigration
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thermomigration
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viscoplasticity
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current crowding
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finite element method
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nanoelectronics packaging
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