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Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading - MaRDI portal

Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading (Q2382374)

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Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading
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    Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading (English)
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    9 October 2007
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    analytical solution
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    peel angle
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    shear crack
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    flexural strengthening
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