A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects |
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A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (English)
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15 October 2007
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Finite element analysis
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constitutive modeling
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strain gradient plasticity
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low cycle fatigue
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damage mechanics
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solder joints
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