A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces |
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A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (English)
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15 October 2007
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Cohesive zone models
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disturbed state concept
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solder interconnections
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thermal fatigue fracture
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