Mechanics of microelectronics (Q2500505)

This is an introductory treatise on the mechanics of microelectronics that has penetrated into every aspects of human life for the past half of a century. The authors who are essentially affiliated to Philips Semiconductors and Delft University have made significant contributions to the main topics. The treatise should be of interest to both the academia and industry, and it can be used as a ``basic source for teaching'' in a graduate course. The book comprises nine chapters, each of which has appropriate references and exercises. Chapter 1 (pp. 1--34) ``Microelectronics technology'' by \textit{A. J. van Roosmalen} presents a concise overview of the origin of microelectronics and its evolution into the nanotechnology era, and it provides a view into future directions. Chapter 2 (pp. 35--63) ``Reliability practice'' by \textit{F. G. Kuper} and \textit{X. J. Fan} is devoted to basic concepts of reliability in microelectronics, and introduces the reliability assessments, the basic reliability statistics, the acceleration factor models and failure mechanisms. Chapter 3 (pp. 65--94) ``Thermal management'' by \textit{H. J. Eggink} and \textit{J. H.J. Janssen} gives an introduction into the basics of heat transfer, thermal resistance and thermal design of electronic products. Chapter 4 (pp. 95--167) ``Introduction to advanced mechanics'' by \textit{J. Zhou} and \textit{G. Q. Zhang} serves as a brief introduction to the basics of mechanics needed for the mechanical analysis in microelectronics. The fundamental principles and the equations of thermoelasticity and fracture mechanics, several constitutive laws and some failure criteria are given. The authors also outline the finite element method and its implementation in fracture mechanics. The energy theorems are excluded. Especially, the coupled analysis of mechanical, thermal, electric, moisture and the alike fields is omitted. Chapter 5 (pp. 169--279) ``Thermo-mechanics of integrated circuits and packages'' by \textit{W. D. van Driel, G. Q. Zhang} and \textit{X. J. Fan} describes the state-of-the-art of thermo-mechanical based prediction methodologies and techniques for integrated circuits and packages. The problems of thermo-mechanics and their solutions are presented for backend and packaging processes, and the interaction between them is discussed. Both the simulations and experimental techniques are described for the solutions. Chapter 6 (pp. 281--375) ``Characterization and modelling of moisture behaviour'' by \textit{X. J. Fan, G. Q. Zhang, W. D. van Driel} and \textit{J. Zhou} introduces the modellings of moisture diffusion in multi-material systems, vapour pressure based on a micromechanical approach, hygroscopic swelling, and the interface strength. The interface delamination and fracture methodologies and applications are presented through several case studies. Chapter 7 (pp. 377--468) ``Characterization and modelling of solder joint reliability'' by \textit{R. Dudek} deals with the finite element analysis of solder fatigue phenomena caused by low-cycle thermo-mechanical loading. Material constitutive models and the implementation of time and temperature-dependent behaviour of solders are described. Some of the application cases are studied, and the results of failure prediction and experiments are compared. Chapter 8 (pp. 469--536) ``Virtual thermo-mechanical prototyping'' by \textit{G. Q. Zhang, N. Tzannetakis} and \textit{W. D. van Driel} presents an overview of the authors' research and development of virtual thermo-mechanical prototyping of microelectronics. The detailed description of their research strategy imbedded in a commercial software, focusing on the efficient development of reliable response surface models, is demonstrated. Several analytical and industrial examples are recorded, covering different application objectives. Chapter 9 (pp. 537--563) ``Challenges and future perspectives'' by \textit{G. Q. Zhang} deals with the related mechanical characteristics of microelectronics, and highlights the challenges and future perspectives of the mechanics of microelectronics. Ten authors wrote, and perhaps three of them edited the treatise which is easy to read. However, the usual author and subject indexes are not included, and references are given inconsistently. In sum, the authors have done a valuable service in presenting the title topics to researchers, engineers and students interested in the mechanics of microelectronics.