Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives (Q2655570)
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scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives |
scientific article |
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Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives (English)
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25 January 2010
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wall-slip
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solder paste
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rheology
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isotropic conductive adhesives
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stencil printing process
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0.6635948419570923
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0.6607316136360168
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0.6518607139587402
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0.6457154154777527
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0.6425595879554749
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