Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial (Q2870379)

The authors formulate a thermoelasticity problem for bimaterial with an interfacial crack with allowance for the contact of crack faces in the central part of the crack caused by thermal deformations due to the heat flow perpendicular to the interface. The bimaterial components differ by the coefficients of thermal conductivities and linear thermal expansion. The crack is filled with a heat-conducting medium and its faces are thermal resistant due to thin surface films. The problem is reduced to a system of nonlinear singular integro-differential equations with respect to a temperature jump between crack faces and crack opening. For the solution of the problem an iterative algorithm is developed based on the method of successive approximations. The effect of the heat flow and film thermal resistance on the size of the crack faces contact, crack opening, temperature jump between the crack faces and interfacial stress intensity factors is analyzed.