Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (Q3076990)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? |
scientific article |
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Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (English)
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21 February 2011
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stretchable electronics
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die-carrier assembly
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stresses
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