A micromechanically motivated higher‐order continuum formulation of linear thermal conduction (Q3164478)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A micromechanically motivated higher‐order continuum formulation of linear thermal conduction |
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A micromechanically motivated higher‐order continuum formulation of linear thermal conduction (English)
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28 October 2010
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thermal conduction
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higher-order continuum
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size effects
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Burnett equations
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