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Thermal analysis of multi‐finger GaInP collector‐up heterojunction bipolar transistors with miniature heat‐dissipation packaging structures - MaRDI portal

Thermal analysis of multi‐finger GaInP collector‐up heterojunction bipolar transistors with miniature heat‐dissipation packaging structures (Q5851129)

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scientific article; zbMATH DE number 5661124
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English
Thermal analysis of multi‐finger GaInP collector‐up heterojunction bipolar transistors with miniature heat‐dissipation packaging structures
scientific article; zbMATH DE number 5661124

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    Thermal analysis of multi‐finger GaInP collector‐up heterojunction bipolar transistors with miniature heat‐dissipation packaging structures (English)
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    21 January 2010
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    GaInP/GaAs
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    collector-up
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    heterojunction bipolar transistor
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    high-power amplifiers
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    heat-dissipation via
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    finite element modeling
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