Analysis of interfacial thermal stresses of chip-substrate structure (Q5926714)
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scientific article; zbMATH DE number 1577889
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analysis of interfacial thermal stresses of chip-substrate structure |
scientific article; zbMATH DE number 1577889 |
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Analysis of interfacial thermal stresses of chip-substrate structure (English)
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5 May 2002
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electronic packaging
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interfacial thermal stress
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chip-substrate structure
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heat conduction
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integrated circuits
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temperature field
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traction-free boundary conditions
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continuity conditions
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variational principle
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