Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer (Q6710817)
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Dataset published at Zenodo repository.
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer |
Dataset published at Zenodo repository. |
Statements
Data used for figures in "Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under bump metallization layer" by A. Paradkar et al. Appl. Phys. Lett.126, 022601 (2025)
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20 January 2025
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v2
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