Modeling and calculation of slurry-chemistry effects on chemical-mechanical planarization with a grooved pad

DOI10.1007/S10665-008-9240-4zbMath1176.74066OpenAlexW2078125599MaRDI QIDQ1000849

J. Martínez

Publication date: 11 February 2009

Published in: Journal of Engineering Mathematics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10665-008-9240-4

zbMATH Keywords

Contact mechanicsChemical-mechanical planarizationGrooved padsLubrication theoryMaterial removal rateSlurry impurity

Mathematics Subject Classification ID

Contact in solid mechanics (74M15) Chemical and reactive effects in solid mechanics (74F25)

Cites Work

• Contact Mechanics

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