Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components

DOI10.1016/J.IJHEATMASSTRANSFER.2008.04.071zbMath1153.80336OpenAlexW2147462343MaRDI QIDQ1001042

J. Martínez

Publication date: 12 February 2009

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2008.04.071

zbMATH Keywords

phase changetransientelectronicsheat pipe

Mathematics Subject Classification ID

Liquid-gas two-phase flows, bubbly flows (76T10)

Related Items (4)

Variational formulation of coupled hydrodynamic problems ⋮ Generalized Brinkman-type fluid model and coupled heat conductivity problem ⋮ On variation models of the irreversible processes in mechanics of solids and generalized hydrodynamics ⋮ Analytical solution of Brinkman hydrodynamics in filtration problems

Cites Work

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• Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components
• Recent advances in the numerical analysis of heat pipes
• A quasi-3D analysis of the thermal performance of a flat heat pipe

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