Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules

DOI10.1016/j.ijheatmasstransfer.2007.10.045zbMath1157.80322OpenAlexW2042209769MaRDI QIDQ1009813

J. P. Meyer, J. Dirker

Publication date: 3 April 2009

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2007.10.045

zbMATH Keywords

electronicspower electronicsembeddedconductiveheat spreading layers

Mathematics Subject Classification ID

Cites Work

• Unnamed Item
• Constructural-theory network of conducting paths for cooling a heat generating volume
• Conduction trees with spacings at the tips
• Constructal optimization of nonuniformly distributed tree-shaped flow structures for conduction

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