Determining the optimal probing lot size for the wafer probe operation in semiconductor manufacturing

DOI10.1016/j.ejor.2008.05.031zbMath1157.90403OpenAlexW2007506434MaRDI QIDQ1011272

Chih-Hsiung Wang

Publication date: 8 April 2009

Published in: European Journal of Operational Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ejor.2008.05.031

zbMATH Keywords

lot sizedeteriorating processwafer probing operation

Mathematics Subject Classification ID

Reliability, availability, maintenance, inspection in operations research (90B25) Production models (90B30)

Related Items

A new discrete distribution, On bivariate discrete Weibull distribution

Cites Work

• Optimal lot sizing for products sold under free-repair warranty.
• Lot sizing and testing for items with uncertain quality
• Optimal lot size and inspection policy for products sold with warranty
• Optimal Lot Sizing, Process Quality Improvement and Setup Cost Reduction
• Lot Sizing to Reduce Capacity Utilization in a Production Process with Defective Items, Process Corrections, and Rework
• Invited paper Perspectives and challenges for research in quality and reliability engineering
• A general minimal repair model
• Inspection Policies When Duration of Checkings is Non-Negligible
• A discrete‐time model of failure and repair