Creep flow, diffusion, and electromigration in small scale interconnects

DOI10.1016/J.JMPS.2006.06.001zbMath1162.74305OpenAlexW2141063909MaRDI QIDQ1019389

Wei Lu, Dongchoul Kim

Publication date: 2 June 2009

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.jmps.2006.06.001

zbMATH Keywords

phase field modelcreepnanostructureelectromigration

Mathematics Subject Classification ID

Brittle fracture (74R10) Experimental work for problems pertaining to mechanics of deformable solids (74-05) Soil and rock mechanics (74L10)

Related Items (1)

A theoretical analysis of the electromigration-induced void morphological evolution under high current density

Cites Work

• Unnamed Item
• Numerical solution of ordinary differential equations
• A Continuum Theory That Couples Creep and Self-Diffusion
• Implicit-Explicit Methods for Time-Dependent Partial Differential Equations
• TWO-PHASE BINARY FLUIDS AND IMMISCIBLE FLUIDS DESCRIBED BY AN ORDER PARAMETER
• Free Energy of a Nonuniform System. I. Interfacial Free Energy
• Dynamics of nanoscale pattern formation of an epitaxial monolayer

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