Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles

DOI10.1007/S10704-008-9254-YzbMath1419.74103OpenAlexW2026119845MaRDI QIDQ1028753

Alireza Shirazi, Hua Lu, Ahmad Varvani-Farahani

Publication date: 6 July 2009

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-008-9254-y

zbMATH Keywords

constitutive modelcreep deformationhysteresis loopthermal cycles

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Thermal effects in solid mechanics (74F05)

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