Interaction between heat dipole and circular interfacial crack

DOI10.1007/s10483-009-1002-xzbMath1177.74339OpenAlexW1968384004MaRDI QIDQ1047276

Chao Xie, You-wen Liu, Wan-Shen Xiao

Publication date: 4 January 2010

Published in: Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10483-009-1002-x

Mathematics Subject Classification ID

Brittle fracture (74R10) Thermal effects in solid mechanics (74F05)

Related Items (2)

Some recent advances in 3D crack and contact analysis of elastic solids with transverse isotropy and multifield coupling ⋮ A novel hybrid technique to decompose in-plane thermoelastic displacement fields into thermal and structural displacement fields

Cites Work

• Unnamed Item
• The axisymmetric contact problem of thermoelasticity in the presence of an internal heat source
• On the thermoelastic stresses of multiple interacting inhomogeneities
• Interaction between a cracked hole and a line crack under uniform heat flux
• Interaction between a rigid inclusion and a line crack under uniform heat flux
• Thermal stresses in an isotropic trimaterial interacting with a pair of point heat source and heat sink
• On the General Solutions for Annular Problems With a Point Heat Source
• On Bonded Circular Inclusions in Plane Thermoelasticity
• Thermoelastic Stress in the Semi-Infinite Solid
• Thermoelectroelastic solution for elliptic inclusions and application to crack-inclusion problems

This page was built for publication: Interaction between heat dipole and circular interfacial crack