An investigation of void formation on a bonded interface of power law creep materials containing a cylindrical particle
DOI10.1007/BF01187262zbMath0687.73018MaRDI QIDQ1263325
Publication date: 1989
Published in: Acta Mechanica (Search for Journal in Brave)
complete bondingcomplete bonding with deformable cylindrical particlecylindrical rigid particleperfectly viscous materialpseudo-stress functionradial bondingrigid cylindrical particlesteady- state vacancy flux distributionthree different bonding mechanisms of a particle interfaceThree stress solutions
Linear elasticity with initial stresses (74B10) Inhomogeneity in solid mechanics (74E05) Stress concentrations, singularities in solid mechanics (74G70) Linear constitutive equations for materials with memory (74D05) Plastic materials, materials of stress-rate and internal-variable type (74C99) Nonlinear constitutive equations for materials with memory (74D10)
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