Thermal-mechanical interface crack behaviour of a surface mount solder joint

DOI10.1016/S0168-874X(98)00028-6zbMath0921.73250OpenAlexW2072043004MaRDI QIDQ1274159

C. M. L. Wu, J. K. L. Lai, Yong-li Wu

Publication date: 12 January 1999

Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0168-874x(98)00028-6

zbMATH Keywords

\(J\)-integralthermal effectlarge residual shear displacementlead-tin solder joint

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05)

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