Process capability study and thermal fatigue life prediction of ceramic BGA solder joints
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Publication:1274160
DOI10.1016/S0168-874X(98)00032-8zbMath0919.73202MaRDI QIDQ1274160
Publication date: 12 January 1999
Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)
elastic and elastic-plastic-creep analysesfailure locationprocess capabilitytemperature cyclic condition
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