A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies

DOI10.1016/S0168-874X(98)00025-0zbMath0920.73354OpenAlexW2089523763MaRDI QIDQ1274163

Farhad Sarvar, Paul P. Conway

Publication date: 12 January 1999

Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0168-874x(98)00025-0

zbMATH Keywords

temperature historyprocess configurationthermal mass distribution

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Technical applications of optics and electromagnetic theory (78A55)

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