Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages

DOI10.1016/S0168-874X(98)00027-4zbMath0921.73249OpenAlexW2000994822MaRDI QIDQ1274164

Sung Yi, Kam-Yim Sze

Publication date: 12 January 1999

Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0168-874x(98)00027-4

zbMATH Keywords

diffusion equationsmoisture soaking test

Mathematics Subject Classification ID

Diffusion (76R50) Finite element methods applied to problems in solid mechanics (74S05)

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