Interface crack in bi-piezothermoelastic media and the interaction with a point heat source

DOI10.1016/S0020-7683(97)00208-4zbMath0918.73054OpenAlexW1964319276WikidataQ127244700 ScholiaQ127244700MaRDI QIDQ1286214

Shengping Shen, Zhen-Bang Kuang

Publication date: 19 August 1999

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(97)00208-4

zbMATH Keywords

electric fieldcrack opening displacementsmethod of analytical continuationelectric inductionEshelby-Stroh's formulationHilbert problem in vector formpiezothermoelastic interface crack problem

Mathematics Subject Classification ID

Related Items (8)

The generalized two dimensional thermal-electro-elastic solution for the cracked-half-elliptical-hole problem in a half plane ⋮ An opening crack model for thermopiezoelectric solids ⋮ Control of thermal stress intensity factor in a piezothermoelastic semi-infinite body with an edge crack ⋮ Boundary integral-differential equations and boundary element method for interfacial cracks in three-dimensional piezoelectric media ⋮ Analysis of in-plane transonically propagating interface crack with a finite contact zone ⋮ A permeable interface crack between dissimilar thermopiezoelectric media ⋮ A unified method for subsonic and intersonic crack growth along an anisotropic bimaterial interface ⋮ Interface crack problems of a laminated piezoelectric plate

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