Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains

DOI10.1016/S0020-7683(96)00207-7zbMath0939.74590MaRDI QIDQ1290005

E. Suhir

Publication date: 2 July 2000

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Mathematics Subject Classification ID

Stefan problems, phase changes, etc. (80A22) Fracture and damage (74R99) Plastic materials, materials of stress-rate and internal-variable type (74C99)

Related Items (1)

Aerospace electronics reliability prediction: application of two advanced probabilistic techniques

This page was built for publication: Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains