Some problems in plane thermopiezoelectric materials with holes

DOI10.1016/S0020-7683(98)00032-8zbMath0942.74021OpenAlexW2043272431WikidataQ127975855 ScholiaQ127975855MaRDI QIDQ1303073

V. Pereyra

Publication date: 21 August 2000

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(98)00032-8

zbMATH Keywords

analytical solutionstress intensity factorsconformal mappingenergy release rateelectric displacementStroh formalismconcentration coefficients

Mathematics Subject Classification ID

Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Related Items (6)

Hybrid fundamental solution based finite element method: theory and applications ⋮ Method of fundamental solutions for 3D elasticity with body forces by coupling compactly supported radial basis functions ⋮ A new hybrid finite element approach for plane piezoelectricity with defects ⋮ Compressibility of two-dimensional pores having n -fold axes of symmetry ⋮ Voronoi Polygonal Hybrid Finite Elements and Their Applications ⋮ A permeable interface crack between dissimilar thermopiezoelectric media

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