Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model

DOI10.1016/0377-0427(93)90062-GzbMath0786.65103MaRDI QIDQ1313188

Meir Shillor, Baruch Cahlon, Irwin E. Schochetman

Publication date: 26 January 1994

Published in: Journal of Computational and Applied Mathematics (Search for Journal in Brave)

zbMATH Keywords

numerical resultsoptimal placementannealing algorithmconvective coolingelectronic boards

Mathematics Subject Classification ID

Heat equation (35K05) Applications to the sciences (65Z05)

Related Items (2)

Simultaneous reconstruction of the time-dependent Robin coefficient and heat flux in heat conduction problems ⋮ Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model

Cites Work

• Unnamed Item
• A model for the convective cooling of electronic components with application to optimal placement
• Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model
• Convergence of an annealing algorithm
• Electronic System Thermal Design for Reliability

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